無鹵PI覆銅箔基材 Halogen-Free Polyimide Film Based FCCL

產品特點：
優異的耐高溫高濕性能
良好的尺寸安定性、撓曲性及耐離子遷移
優良的電性能，化學性能及耐熱性能
不含鹵素, 阻燃性能達到UL94 VTM-0
本產品符合IPC規范

Feature：
Excellent high humidity and temperature resistance
Excellent dimensional stability，High flexibility and
Excellent Migration ability
Excellent electrical ,chemical and thermal property
Halogen free and Flame retardancy UL 94VTM-0
Meet with IPC standards

產品特性(FCCL Characteristic)：

特性 property		單位 Unit	條件 Condition	標準 Standard	AFED131218	AFED131212	測試方法 Test method
					Copper Foil
					Adhesive
					PI Film
					Adhesive
					Copper Foil
Peel Strength		Kgf/cm (90?)	normal	H mil≧0.8 1 mil≧1.0	1.3~1.5	1.1~1.3	IPC-TM-650 2.4.9
Dimension Stability	TD	%	Method B	≦±0.15	0.05~0.10	0.40~0.08	IPC-TM-650 2.2.4
	MD	%			-0.05~0.06	-0.07~0.03
Solder Float Resistance		---	300℃/10sec	No Change Appearance	Pass	Pass	IPC-TM-650 2.4.13
Chemical Resistance		%	NaOH	≦20	1~7	1~7	IPC-TM-650 2.3.2
		%	HCI		1~8	1~8
		%	IPA		1~7	1~7
Moisture Absorption		%	D-24/23	≦2.0	0.9~1.3	1.0~1.4	IPC-TM-650 2.6.2
Volume Resistance		Ω-cm	C-96/23/65	≧1012	≧1014	≧1014	IPC-TM-650 2.5.17
Surface Resistance		Ω	C-96/23/65	≧1010	≧1012	≧1012
Insulation resistance		Ω	C-96/23/65	≧109	≧109	≧109	IPC-TM-650 2.6.3.2
Dielectric constant 10MHZ		---	C-48/40/90	≦4.0	3.4~3.6		IPC-TM-650 2.5.5.3
Dissipation factor 10MHZ		---	C-48/40/90	≦0.04	0.032~0.036

Note:1. Data shown above are nominal values for reference only，Details see Certification of Quality
  2. Storage Condition：Vacuum Packaging: Below 30℃ for 1year，
Normal Packaging : Below 30℃,below 70% RH for 1year